Shear Strength and Interfacial Compound of Sn-Ag-Bi-In Alloy
نویسندگان
چکیده
منابع مشابه
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages
Sn–9Zn solder joints containing Ag nano particles were prepared by mechanically mixing Ag nano particles (0.3, 0.5 and 1 wt%) with Sn–9Zn solder paste. In the monolithic Sn–Zn solder joints, scallop-shaped AuZn3 intermetallic compound layers were found at their interfaces. However, after the addition of Ag nano particles, an additional uniform AgZn3 intermetallic compound layer well adhered to ...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2002
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.43.1791